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1

Reliability assessment of a MEMS microphone under mixed flowing gas environment and shock impact loading

Li, Jue, Broas, Mikael, Raami, Jani, Mattila, Toni T., Paulasto-Kröckel, Mervi

Journal:

Microelectronics Reliability

Year:

2014

Language:

english

File:

PDF, 2.78 MB

english, 2014

2

[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - Methods for reliability assessment of MEMS devices — Case studies of a MEMS microphone and a 3-axis MEMS gyroscope

Hokka, J., Raami, J., Hyvonen, H., Broas, M., Makkonen, J., Li, J., Mattila, T. T., Paulasto-Krockel, M.

Year:

2012

Language:

english

File:

PDF, 1.40 MB

english, 2012

3

Shock Impact Reliability and Failure Analysis of a Three-Axis MEMS Gyroscope

Li, Jue, Broas, Mikael, Makkonen, Joonas, Mattila, Toni T., Hokka, Jussi, Paulasto-Krockel, Mervi

Journal:

Journal of Microelectromechanical Systems

Year:

2014

Language:

english

File:

PDF, 1.60 MB

english, 2014

4

Flip chip die attach development for multichip mechatronics power packages

Paulasto-Krockel, M., Hauck, T.

Journal:

IEEE Transactions on Electronics Packaging Manufacturing

Year:

2001

Language:

english

File:

PDF, 270 KB

english, 2001

5

[IEEE 2018 7th Electronic System-Integration Technology Conference (ESTC) - Dresden, Germany (2018.9.18-2018.9.21)] 2018 7th Electronic System-Integration Technology Conference (ESTC) - Process Integration and Reliability of Wafer Level SLID Bonding for Poly-Si TSV capped MEMS

Vuorinen, Vesa, Ross, Glenn, Viljanen, Heikki, Decker, James, Paulasto-Krockel, Mervi

Year:

2018

File:

PDF, 730 KB

2018

6

Welsh English || 2 Phonetics and phonology

Paulasto, Heli, Penhallurick, Rob, A. Jones, Benjamin

Year:

2021

File:

PDF, 120 KB

2021

7

Welsh English || 3 Morphosyntax

Paulasto, Heli, Penhallurick, Rob, A. Jones, Benjamin

Year:

2021

File:

PDF, 456 KB

2021

8

Thermomechanical reliability characterization of a handheld product in accelerated tests and use environment

J.S. Karppinen, J. Li, T.T. Mattila, Mervi Paulasto-Kröckel

Journal:

Microelectronics Reliability

Year:

2010

Language:

english

File:

PDF, 1.24 MB

english, 2010

9

Toward comprehensive reliability assessment of electronics by a combined loading approach

T.T. Mattila, M. Paulasto-Kröckel

Journal:

Microelectronics Reliability

Year:

2011

Language:

english

File:

PDF, 2.94 MB

english, 2011

10

Shock impact reliability characterization of a handheld product in accelerated tests and use environment

J. Karppinen, J. Li, J. Pakarinen, T.T. Mattila, M. Paulasto-Kröckel

Journal:

Microelectronics Reliability

Year:

2012

Language:

english

File:

PDF, 1.99 MB

english, 2012

11

The reliability of component boards studied with different shock impact repetition frequencies

Jussi Hokka, Jue Li, Toni T. Mattila, Mervi Paulasto-Kröckel

Journal:

Microelectronics Reliability

Year:

2012

Language:

english

File:

PDF, 1.39 MB

english, 2012

12

Effect of isothermal annealing and electromigration pre-treatments on the reliability of solder interconnections under vibration loading

T. Laurila, J. Karppinen, J. Li, V. Vuorinen, M. Paulasto-Kröckel

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2013

Language:

english

File:

PDF, 1001 KB

english, 2013

13

A reliability study of adhesion mechanism between liquid crystal polymer and silicone adhesive

Jue Li, Markus Turunen, Sini Niiranen, Hongtao Chen, Mervi Paulasto-Kröckel

Journal:

Microelectronics Reliability

Year:

2012

Language:

english

File:

PDF, 1.12 MB

english, 2012

14

[IEEE Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Bordeaux, France (2010.04.26-2010.04.28)] 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) - Toward comprehensive reliability testing of electronic component boards

Mattila, T. T., Paulasto-Krockel, M.

Year:

2010

Language:

english

File:

PDF, 2.58 MB

english, 2010

15

The Effects of Concurrent Power and Vibration Loads on the Reliability of Board-Level Interconnections in Power Electronic Assemblies

Karppinen, J. S., Li, J., Paulasto-Krockel, M.

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2013

Language:

english

File:

PDF, 1.92 MB

english, 2013

16

The Reliability of Microalloyed Sn-Ag-Cu Solder Interconnections Under Cyclic Thermal and Mechanical Shock Loading

Mattila, Toni T., Hokka, Jussi, Paulasto-Kröckel, Mervi

Journal:

Journal of Electronic Materials

Year:

2014

Language:

english

File:

PDF, 8.21 MB

english, 2014

17

[Microsystems] Interfacial Compatibility in Microelectronics || Interfacial Adhesion in Polymer Systems

Laurila, Tomi, Vuorinen, Vesa, Paulasto-Kröckel, Mervi, Turunen, Markus, Mattila, Toni T., Kivilahti, Jorma

Year:

2012

Language:

english

File:

PDF, 535 KB

english, 2012

18

[IEEE 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2015.5.26-2015.5.29)] 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - Void formation in Cu-Sn micro-connects

Ross, Glenn, Vuorinen, Vesa, Paulasto-Krockel, Mervi

Year:

2015

Language:

english

File:

PDF, 1.46 MB

english, 2015

19

Microstructural Characterization and Mechanical Performance of Wafer-Level SLID Bonded Au-Sn and Cu-Sn Seal Rings for MEMS Encapsulation

Rautiainen, Antti, Xu, Hongbo, Österlund, Elmeri, Li, Jue, Vuorinen, Vesa, Paulasto-Kröckel, Mervi

Journal:

Journal of Electronic Materials

Year:

2015

Language:

english

File:

PDF, 3.12 MB

english, 2015

20

Microstructural Evolution and Mechanical Properties of Au-20wt.%Sn|Ni Interconnection

Dong, H.Q., Vuorinen, V., Liu, X.W., Laurila, T., Li, J., Paulasto-Kröckel, M.

Journal:

Journal of Electronic Materials

Year:

2016

Language:

english

File:

PDF, 1.96 MB

english, 2016

21

Void formation and its impact on CuSn intermetallic compound formation

Ross, Glenn, Vuorinen, Vesa, Paulasto-Kröckel, Mervi

Journal:

Journal of Alloys and Compounds

Year:

2016

Language:

english

File:

PDF, 3.89 MB

english, 2016

22

Finite element analyses and lifetime predictions for SnAgCu solder interconnections in thermal shock tests

Li, Jue, Xu, Hongbo, Hokka, Jussi, Mattila, Toni T., Chen, Hongtao, Paulasto‐Kröckel, Mervi

Journal:

Soldering & Surface Mount Technology

Year:

2011

Language:

english

File:

PDF, 364 KB

english, 2011

23

Interfacial Reactions Between ZnAl(Ge) Solders on Cu and Ni Substrates

Rautiainen, Antti, Vuorinen, Vesa, Paulasto-Kröckel, Mervi

Journal:

Journal of Electronic Materials

Year:

2017

Language:

english

File:

PDF, 3.88 MB

english, 2017

24

Extended uses of the progressive form in L1 and L2 Englishes

Year:

2014

Language:

english

File:

PDF, 287 KB

english, 2014

25

Microstructural Evolution and Mechanical Properties in (AuSn)eut-Cu Interconnections

Dong, Hongqun, Vuorinen, Vesa, Laurila, Tomi, Paulasto-Kröckel, Mervi

Journal:

Journal of Electronic Materials

Year:

2016

Language:

english

File:

PDF, 1.67 MB

english, 2016

26

XRD and ToF-SIMS study of intermetallic void formation in Cu-Sn micro-connects

Ross, G., Vuorinen, V., Krause, M., Reissaus, S., Petzold, M., Paulasto-Kröckel, M.

Journal:

Microelectronics Reliability

Year:

2017

Language:

english

File:

PDF, 1.84 MB

english, 2017

27

Wafer-Level AuSn/Pt Solid–Liquid Interdiffusion Bonding

Rautiainen, Antti, Vuorinen, Vesa, Heikkinen, Hannele, Paulasto-Krockel, Mervi

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2018

Language:

english

File:

PDF, 5.80 MB

english, 2018

28

Metalorganic chemical vapor deposition of aluminum nitride on vertical surfaces

Österlund, Elmeri, Suihkonen, Sami, Ross, Glenn, Torkkeli, Altti, Kuisma, Heikki, Paulasto-Kröckel, Mervi

Journal:

Journal of Crystal Growth

Year:

2020

Language:

english

File:

PDF, 2.12 MB

english, 2020

29

Sandra S. Deshors, Sandra GÃ¶tz and Samantha Laporte (eds.), Rethinking linguistic creativity in non-native Englishes. Amsterdam and Philadelphia: John Benjamins, 2018. Pp. vi + 223. ISBN 9789027201461.

Journal:

English Language and Linguistics

Year:

2019

File:

PDF, 107 KB

2019

30

Welsh English || 1 Geography, demography, cultural factors, and variation

Paulasto, Heli, Penhallurick, Rob, A. Jones, Benjamin

Year:

2021

File:

PDF, 468 KB

2021

31

Impurity and alloying effects on interfacial reaction layers in Pb-free soldering

T. Laurila, V. Vuorinen, M. Paulasto-Kröckel

Journal:

Materials Science and Engineering: R: Reports

Year:

2010

Language:

english

File:

PDF, 3.21 MB

english, 2010

32

FEM simulations for reliability assessment of component boards drop tested at various temperatures

J. Li, T.T. Mattila, H. Xu, M. Paulasto

Journal:

Simulation Modelling Practice and Theory

Year:

2010

Language:

english

File:

PDF, 1.12 MB

english, 2010

33

The reactive route to ceramic joining: Fabrication, interfacial chemistry and joint properties

S.D. Peteves, M. Paulasto, G. Ceccone, V. Stamos

Journal:

Acta Materialia

Year:

1998

Language:

english

File:

PDF, 1.08 MB

english, 1998

34

Effect of Constant and Cyclic Current Stressing on the Evolution of Intermetallic Compound Layers

T. Laurila, J. Karppinen, V. Vuorinen, A. Paul, M. Paulasto-Kröckel

Journal:

Journal of Electronic Materials

Year:

2011

Language:

english

File:

PDF, 544 KB

english, 2011

35

Joining silicon nitride to itself and to metals

Stathis D. Peteves, Giacomo Ceccone, Mervi Paulasto, Vassilis Stamos, Pascal J. Yvon

Journal:

JOM Journal of the Minerals, Metals and Materials Society

Year:

1996

Language:

english

File:

PDF, 2.89 MB

english, 1996

36

Joining of silicon nitride via a transient liquid

M. Paulasto, G. Ceccone, S.D. Peteves

Journal:

Scripta Materialia

Year:

1997

Language:

english

File:

PDF, 784 KB

english, 1997

37

Formation of interfacial microstructure in brazing of Si3N4 with Ti-activated Ag-Cu filler alloys

M. Paulasto, J.K. Kivilahti

Journal:

Scripta Metallurgica et Materialia

Year:

1995

Language:

english

File:

PDF, 513 KB

english, 1995

38

Thermodynamic assessment of Au–Ho and Au–Tm binary systems

H.Q. Dong, X.M. Tao, T. Laurila, M. Paulasto-Kröckel

Journal:

Year:

2012

Language:

english

File:

PDF, 568 KB

english, 2012

39

Simulation of dynamic recrystallization in solder interconnections during thermal cycling

J. Li, H. Xu, T.T. Mattila, J.K. Kivilahti, T. Laurila, M. Paulasto-Kröckel

Journal:

Computational Materials Science

Year:

2010

Language:

english

File:

PDF, 1.36 MB

english, 2010

40

Feature-invariant image registration method for quantification of surgical outcomes in patients with craniosynostosis: a preliminary study

Marcelo Elias de Oliveira, Harri Hallila, Antti Ritvanen, Philippe Büchler, Mervi Paulasto, Jyri Hukki

Journal:

Journal of Pediatric Surgery

Year:

2011

Language:

english

File:

PDF, 1.26 MB

english, 2011

41

Hyperelastic Property Measurements of Heat-Cured Silicone Adhesives by Cyclic Uniaxial Tensile Test

Jue Li, Tapio Tarvainen, Jaana Rich, Markus Turunen, Mervi Paulasto-Kröckel

Journal:

Journal of Electronic Materials

Year:

2012

Language:

english

File:

PDF, 703 KB

english, 2012

42

The Combined Effect of Shock Impacts and Operational Power Cycles on the Reliability of Handheld Device Component Board Interconnections

J.S. Karppinen, T. Laurila, T.T. Mattila, M. Paulasto-Kröckel

Journal:

Journal of Electronic Materials

Year:

2012

Language:

english

File:

PDF, 1.61 MB

english, 2012

43

Effect of Isothermal Aging and Electromigration on the Microstructural Evolution of Solder Interconnections During Thermomechanical Loading

T. Laurila, J. Karppinen, V. Vuorinen, J. Li, A. Paul, M. Paulasto-Kröckel

Journal:

Journal of Electronic Materials

Year:

2012

Language:

english

File:

PDF, 1.61 MB

english, 2012

44

Thermodynamic and experimental study of TiAgCu alloys

M. Paulasto, F.J.J. van Loo, J.K. Kivilahti

Journal:

Journal of Alloys and Compounds

Year:

1995

Language:

english

File:

PDF, 569 KB

english, 1995

45

Thermal Cycling Reliability of Sn-Ag-Cu Solder Interconnections. Part 1: Effects of Test Parameters

Hokka, Jussi, Mattila, Toni. T., Xu, Hongbo, Paulasto-KrÃ¶ckel, Mervi

Journal:

Journal of Electronic Materials

Year:

2013

Language:

english

File:

PDF, 1.08 MB

english, 2013

46

Thermal Cycling Reliability of Sn-Ag-Cu Solder Interconnections—Part 2: Failure Mechanisms

Hokka, Jussi, Mattila, Toni T., Xu, Hongbo, Paulasto-KrÃ¶ckel, Mervi

Journal:

Journal of Electronic Materials

Year:

2013

Language:

english

File:

PDF, 2.75 MB

english, 2013

47

Thermal simulation of high-power Li-ion battery with LiMn1/3Ni1/3Co1/3O2 cathode on cell and module levels

Abdul-Quadir, Yasir, Laurila, Tomi, Karppinen, Juha, Paulasto-Kröckel, Mervi

Journal:

International Journal of Energy Research

Year:

2014

Language:

english

File:

PDF, 1.28 MB

english, 2014

48

[IEEE 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Wroclaw (2013.4.14-2013.4.17)] 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Reliability assessment of a MEMS microphone under shock impact loading

Li, J., Makkonen, J., Broas, M., Hokka, J., Mattila, T. T., Paulasto-Krockel, M., Meng, J., Dasgupta, A.

Year:

2013

Language:

english

File:

PDF, 1.86 MB

english, 2013

49

Thermodynamic modeling of Au–Ce–Sn ternary system

Dong, H.Q., Tao, X.M., Laurila, T., Vuorinen, V., Paulasto-Kröckel, M.

Journal:

Year:

2013

Language:

english

File:

PDF, 1.78 MB

english, 2013

50

Thermodynamic reassessment of Au–Cu–Sn ternary system

Dong, H.Q., Vuorinen, V., Tao, X.M., Laurila, T., Paulasto-Kröckel, M.

Journal:

Journal of Alloys and Compounds

Year:

2014

Language:

english

File:

PDF, 3.35 MB

english, 2014

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